產(chǎn)品簡(jiǎn)介
Elite Etch 7000是一款先進(jìn)的自動(dòng)混合酸蝕刻開封機(jī)。通過供給精確的、微量的硝酸、硫酸或混合酸，開封機(jī)能夠快速打開各種芯片IC封裝。
酸液在蝕刻腔中產(chǎn)生極端的湍流，大大加快了封裝劑的去除速度。同時(shí)精確的酸溫和高流速保證了開封過程不會(huì)損壞鍵合線。
Elite蝕刻采用了最新的創(chuàng)新技術(shù)。蝕刻頭由優(yōu)質(zhì)碳化硅加工而成，具有極強(qiáng)的耐酸性和耐溫性。結(jié)合氮?dú)獗O(jiān)測(cè)和吹掃系統(tǒng)，這種整體設(shè)計(jì)可以減少解封裝后殘留在蝕刻頭上的酸液。高導(dǎo)熱的碳化硅蝕刻頭縮短了加熱時(shí)間。
蝕刻過程被設(shè)計(jì)在通風(fēng)柜內(nèi)，同時(shí)保證了必要的安全功能。通過熱交換系統(tǒng)，廢酸被冷卻到90攝氏度以下，并輸送到廢液瓶中。
Elite Etch 7000在酸液容器和開封機(jī)之間的所有流體接頭都采用了雙重密封。容器組件和蝕刻單元都包含流體傳感器，當(dāng)任何容器或組件發(fā)生酸液泄漏時(shí)，設(shè)備將自動(dòng)發(fā)出警報(bào)。
產(chǎn)品應(yīng)用
芯片開封
失效分析
規(guī)格參數(shù)
Etcher Unit | Height: 300 mm (13 in) Width: 190 mm (7.5 in) Depth: 305 mm (12 in) |
Bottle Assembly | Height: 254 mm (10 in) Width: 280 mm (11 in) Depth: 127 mm (5 in) |
Weight | Approx. 16 kg (35 lb) |
Power Source | 90 to 250 VAC, 50 to 60 Hz (4 amp) |
Acid temp. range | 20° to 250° C |
Acid temp. set point | 1° C ± 1% of setting |
Etch cavity (up to) | 22 mm x 22 mm (30 mm diagonal) |
Choice of Acids | fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid |
Acid Mix Ratios | (nitric to sulfuric ratios) 9:1, 5:1, 4:1, 3:1, 2:1, 1:1 |
Post Etch Rinse Options | sulfuric acids, fuming nitric acids, mixed acids, or no rinse |
Etch Times | 1 to 1,800 seconds in 1 second increments (1 seconds to 30 minutes) dynamic (real time) adjustments of etch time |
Etch Temperature Ranges | 20° to 90° C (nitric acid), 20° to 250° C (sulfuric acid), 20° to 100° C (mixed acids) |
Etchant Volume Selection | 1 to 6 ml per minute - for all acids & acid mixes |
