AugmentedAlign Tool: Improves RF, mmW and THz measurement accuracy and simplifies probe positioning
Find Feature Tool: Pattern recognition-based dimensional feedback of probe position with μm resolution
Live Vision with Analytical Tools: Maximum ergonomics with Measure On-Screen and Snap Image
Python-based Scripting Console: Allows user code for control of WinCal, VNA and more

This helps improve speed and accuracy of probing and assists design debug and presentation of measurement results. For RF/mmW/THz measurements it enables faster calibration and improves accuracy and repeatability.

2. ReAlign? for SUMMIT200 delivers autonomous operation for vertical probe cards, and helps bring faster time to data:

Near-on-axis technology: high thermal stability with small station footprint
Measurements over temperature with optional RF/DC cover: EMI-shielded, dark and frost-free
Modular design: interchangeable with other application layers, (i.e. RF TopHat)
Full wafer Z-profiling
Single die alignment without a microscope

3. Interval Backup delivers automated backup of projects and configuration files, an easy-to-use recovery function. Data is stored separately from the Velox storage medium delivering user-relevant data protection.

4. Finally, Auto Align has been optimized to be 10 percent faster, delivering faster time to measurement.

For more information on Velox 3.2.1, visit the website, or download the latest brochure (PDF).

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